Integration with Other Subsystems
- System-Level Integration Integrating Subsystems with the Backplane Board
Connecting EPS, OBC, ADCS, and Payload modules. Managing data and power dependencies between subsystems. Thermal Considerations for BPB Design
Impact of thermal cycles on PCB components. Techniques for thermal management (heat sinks, vias, thermal pads). Vibration and Shock Testing for CubeSat BPBs
Designing for mechanical robustness. Case studies from BIRDS missions.